3M™ UV-Curable Adhesive LC-3200
3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.
Post-it Page Markers in assorted colors and 1/2 in x 2 in size are ideal for the temporary marking of reference materials. They stay put until you decide to move them. The rainbow of colors in every pack are easy to spot and easy to write on. Works like a note and flag combined. Contains 50 sheets/pad and 5 pads/pack. Ideal for temporary marking of reference materials. Stays put until you decide to move it. Rainbow of color in every pack are easy to spot and easy to write on.
Post-it Page Markers, 1/2 in x 1 3/4 in, Assorted Fluorescent Colors , 50 Sheets/Pad, 5 PadsPer Pack (670-5AF)
Temporary Bonding & Debonding - Semiconductor
UV Adhesives ConRo Electronics
UV Adhesives - Light cure glue - Fast curing adhesives
Temporary Bonding & Debonding - Semiconductor
UV Adhesives ConRo Electronics
UV Adhesives ConRo Electronics
UV Glue, UV Adhesives
Acrylic adhesive / wafer / UV-curable - 3500 CP
UV-Curing Optical Adhesives
Temporary bonding enables new processes requiring ultra-thin wafers - Document - Gale Academic OneFile
Update To Hantek DSO1062S Problems, 53% OFF
Thorlabs - K6-NOA Adhesive Kit (Contains All 6 of the NOA UV
Update To Hantek DSO1062S Problems, 53% OFF
3M™ UV-Curable Adhesive LC-3200
